Time: 2024.11.05
Infineon Technologies recently announced the launch of the world's first 20-micron-thick ultra-thin silicon power wafer, making it the first company to master this advanced processing technology. The new wafer has a diameter of 300 mm and is only one-quarter the thickness of a hair, which is half the thickness of the 40-60 micron wafers currently used in the industry.
Impact of Infineon's technological breakthrough
Jochen Hanebeck, CEO of Infineon Technologies, said that the new ultra-thin silicon wafer represents an important progress in the company's promotion of power semiconductor technology, which will help create more value in the global pursuit of low carbonization and digitalization. This technology not only demonstrates Infineon's advantages in semiconductor materials such as Si, SiC and GaN, but also consolidates its leading position in industry innovation.
The main advantages of 20-micron ultra-thin power wafers include:
Improved thermal performance: Thinner wafers can improve heat dissipation performance, reduce heat accumulation in chips during operation, and ensure stable operation.
Performance improvement: Halving the thickness of the wafer can reduce the substrate resistance by about 50%, thereby reducing power loss, which is particularly suitable for the power conversion needs of high-end AI servers.
Packaging adaptability: Ultra-thin wafers can support more compact packaging designs, improve power density and reduce chip size and weight.
Faced with challenges, Infineon has adopted innovative wafer grinding processes and developed patented technologies to deal with warpage problems to ensure production accuracy and device reliability.
Infineon's position in the power semiconductor market
With a significant share of 22.8% in the global power semiconductor market, Infineon continues to lead in technological innovation and market share. With a comprehensive power product line, including Si, SiC, GaN, etc., Infineon continues to expand its market influence.
Infineon's silicon carbide wafer fab project in Malaysia marks a further improvement in power semiconductor manufacturing capabilities, which may redefine the global market landscape.
Impact on global and domestic markets
The global power semiconductor market is growing steadily, and the market size is expected to reach US$52.2 billion by 2024. Infineon's dominant position in Si, SiC and GaN technologies may intensify market competition, especially posing a challenge to domestic power semiconductor manufacturers.
As the largest share of global power semiconductor demand, the Chinese market is catching up, and many influential domestic manufacturers have emerged. However, domestic companies still need to accelerate their pace of catching up in core technologies and high-end markets to cope with the competitive pressure from international leading manufacturers and the challenges brought by technological iteration.
Summary
Although the growth of the global power semiconductor market has slowed down, technological innovation and market competition remain fierce. For domestic manufacturers, it is crucial to enhance their technological R&D capabilities and new production capabilities in order to gain greater competitive advantages on the international stage
